課程資訊
課程名稱
精密陶瓷膠粒製程
COLLOIDAL PROCESSING OF FINE CERAMICS 
開課學期
98-1 
授課對象
工學院  材料科學與工程學研究所  
授課教師
韋文誠 
課號
MSE7036 
課程識別碼
527 M3900 
班次
 
學分
全/半年
半年 
必/選修
選修 
上課時間
星期二2(9:10~10:00)星期五6,7(13:20~15:10) 
上課地點
工綜213工綜211 
備註
總人數上限:20人 
 
課程簡介影片
 
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課程概述

New wet processes are invented in the past two decades. The process offers the capability of synthesizing various ceramic materials.
This class we will introduce the interactions (electrostatic and steric) between particles in solution. That are strongly influenced by the powder and types of solution and processing agents.
The chemistry of solutions, the function group and molecular characteristics of polymeric additives used for the improement of the ceramics will be introduced.
Finally more than 10 wet processes are introduced.
The properties of well-perform slurry is the keys to fabricate consistent parts with acceptable properties.
 

課程目標
1. build up the background on the wet process of ceramic materials;
2. understand the fundamental of powder interaction in solution stage;
3. familier with the compounds and chemicals in the process;
4. learn the details of the wet processes.
 
課程要求
1. Graduate students;
2. The students should have the background of Materials science or Chemical engineering;
3. Paper Reading (Paradigm study)  
預期每週課後學習時數
 
Office Hours
備註: 週五上午11-12:30 
指定閱讀
1. 黃坤祥,粉末冶金,第三章,粉末特性之分析
2. R. G. Horn, “Surface forces and their action in ceramic materials,” J. Am. Ceram Soc., 73[5] pp.1117-1135 (1990)
3. W. J. Wei, S. C. Wang, and F. Y. Ho, 1999, “Electrokinetic properties of colloidal zirconia powder in aqueous suspension,” J. Am. Ceram. Soc., 82[12] 3385-92 (2000)
4. K. C. Hsu, K. L. Ying, L. P. Chen, , B. Y. Yu, and W. J. Wei, “Dispersive properties of BaTiO3 colloids with amphoteric polyelectrolytes” J. Am. Ceram. Soc., 88[3]524-529 (2005)
5. T. J. Fennelly and J. S. Reed, ” Mechanics of pressure slip casting,” J. Am. Ceram. Soc., 55[5] pp.264-268 (1972)
6. B. V. Velamakanni and F. F. Lange, “Effect of interparticle potential and sedimentation on particle packing density of bimodel particle distribution during pressure filtration, “ J. Am. Ceram. Soc., 74[1]166-72 (1991)
7. J. Cesarano III, and I. A. Oksay, “Stability of aqueous (83d1)-Al2O3 suspensions with poly(methacrylic acid) polyelectrolyte,” J. Am. Ceram .Soc., 71[4] 250-55 (1988)
8. K. S. Chou and L. J. Lee, “Effect of dispersants on the rheological properties and slip casting of concentrated alumina Slurry,” J. Am. Ceram. Soc., 72[9]1622-27 (1989)
9. S. Blackburn and T. A. Lawson, “Mullite alumina composite by extrusion,” J. Am. Ceram. Soc., 75[4] 953-57 (1992)
10. S. Kawai, Y. Ichikawa, H. Ishida, Y. Shibasaki, and K. Oda, “Mechanism of plasticity development for ceramic dough (part 2),” J. Ceram. Soc. Jpn., 107[1] 54-59 (1999)
 
參考書目
1.Reed, Principles of Ceramics Processing, chapters 9-12, 15-16, 23-26.
2.Shaw, Introduction to Colloid and Surface Chemistry, Chapters 6-9 and six review papers.
 
評量方式
(僅供參考)
 
No.
項目
百分比
說明
1. 
報告(作業) 
20% 
指定教材心得報告一篇。 
2. 
期中考 
40% 
關書考試 
3. 
期末考 
40% 
關書考試 
 
課程進度
週次
日期
單元主題
第1週
9/15,9/18  Chapter 1. Introductionof Wet processes
 
第2週
9/22,9/25  chpater II. Surface Chemistry and Reactions of Ceramic Colloids 
第3週
9/29,10/02  chapter III. Surface Forces (i) 
第4週
10/06,10/09  chapter III. Surface Forces (iI)
 
第5週
10/13,10/16  chpater IV. Colloidal States (i) 
第6週
10/20,10/23  chpater IV. Colloidal States (ii) 
第7週
10/27,10/30  chpater IV. Colloidal States (iii) 
第8週
11/03,11/06  chapter V. Processing Carriers and Additives (i) 
第9週
11/10,11/13  chapter V. Processing Carriers and Additives (ii) 
第10週
11/17,11/20  chapter V. Processing Carriers and Additives (iii) 
第11週
11/24,11/27  chapter VI. Rheological Behavior of Ceramic Systems (I) 
第12週
12/01,12/04  chapter VI. Rheological Behavior of Ceramic Systems (II) 
第13週
12/08,12/11  chapter VI. Rheological Behavior of Ceramic Systems (III) 
第14週
12/15,12/18  chapter VII. Colloidal Processes (I) 
第15週
12/22,12/25  chapter VII. Colloidal Processes (II) 
第16週
12/29,1/01  chapter VII. Colloidal Processes (III) 
第17週
1/05,1/08  chapter VIII. Other Wet Processes